Aligner and exposure method for manufacturing semiconductor devi

Details Aligner and exposure method for manufacturing semiconductor devi Aligner and exposure method for manufacturing semiconductor devi

1992-09-02

1993-12-14

Wintercorn, Richard A.

Photocopying

Projection printing and copying cameras

Step and repeat

355 30, 355 55, G03B 2752, G03B 2742

Patent

active

052707717

ABSTRACT:
An aligner includes a system for projecting a pattern on an original plate onto a substrate, a stage for moving the substrate in two dimensions to sequentially project the pattern on the substrate, first and second devices for determining a change in projection magnification of the system in accordance with the output of a sensor for measuring at least one of temperature, humidity, and atmospheric pressure, and in accordance with the amount of illumination accumulated by detecting exposure light for exposing the substrate to the pattern, a device for sequentially detecting marks in first and second shot zones on the substrate when an interferometer measures the distance the stage is moved, a device for determining the ratio at which the substrate expands or contracts using the output of the detecting device, and a device for adjusting the magnification of the system for projecting the pattern, on the basis of an output from the ratio determining device and the first and second determining devices.

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