Dynamic magnetic information storage or retrieval – Head mounting – Disk record
Reexamination Certificate
2007-11-29
2011-10-25
Evans, Jefferson (Department: 2627)
Dynamic magnetic information storage or retrieval
Head mounting
Disk record
C360S245900, C360S246000
Reexamination Certificate
active
08045296
ABSTRACT:
An integrated lead flexure having a spring metal layer, a dielectric insulating layer on a side of the spring metal layer, a conductor layer on the side of the insulating layer opposite the spring metal layer and a coverlay on the side of the conductor layer opposite the insulating layer. The flexure further includes base region, a gimbal region extending from the base region, and a tail region extending from the base region opposite the gimbal region. The conductor layer includes terminal pads at the tail region and head bond pads at the gimbal region. Traces in the conductor layer extend between the terminal pads and the head bond pads across the tail, base and gimbal regions. One or more spring metal windows in the spring metal layer at the tail region are adjacent to substantial portions of at least some of the traces. One or more coverlay windows in the coverlay at the tail region are adjacent to substantial portions of the tail region spring metal windows.
REFERENCES:
patent: 4906803 (1990-03-01), Albrechta et al.
patent: 5666717 (1997-09-01), Matsumoto et al.
patent: 5839193 (1998-11-01), Bennin et al.
patent: 5995329 (1999-11-01), Shiraishi et al.
patent: 6380493 (2002-04-01), Morita et al.
patent: 6576148 (2003-06-01), Shum et al.
patent: 6631052 (2003-10-01), Girard et al.
patent: 6673256 (2004-01-01), Takasugi
patent: 6891700 (2005-05-01), Shiraishi et al.
patent: 7489479 (2009-02-01), Arya et al.
patent: 7813082 (2010-10-01), Rice et al.
patent: 7813084 (2010-10-01), Hentges
patent: 7826177 (2010-11-01), Zhang et al.
patent: 2002/0181156 (2002-12-01), Shiraishi et al.
patent: 2002/0181157 (2002-12-01), Serizawa et al.
patent: 2003/0026078 (2003-02-01), Komatsubara et al.
patent: 2003/0053257 (2003-03-01), Wada et al.
patent: 2005/0248885 (2005-11-01), Funada et al.
patent: 2007/0230059 (2007-10-01), Ota et al.
Evans Jefferson
Faegre & Benson LLP
Hutchinson Technology Incorporated
LandOfFree
Aligned coverlay and metal layer windows for integrated lead... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Aligned coverlay and metal layer windows for integrated lead..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Aligned coverlay and metal layer windows for integrated lead... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4299893