Al-Cu bonded structure and method for making the same

Details Al-Cu bonded structure and method for making the same Al-Cu bonded structure and method for making the same

2005-07-26

2005-07-26

Zimmerman, John J. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S650000, C428S673000, C228S235300, C228S262510, C228S262610, C228S158000

Reexamination Certificate

active

06921583

ABSTRACT:
With an Al—Cu bonded structure, an Ag layer can be remained at the Al—Cu bonding interlayer providing ductile deformation behavior and a tensile strength at the bonded interlayer similar to that of the Al base material. This results in superior bonding characteristics. Furthermore, a thin Al—Cu bonded structure can be obtained as a result of using the Al—Cu dissimilar material bonded section, which has superior workability, as the base material to perform rolling for wall-thickness reduction. The thin Al—Cu structure has superior dimensional accuracy and can meet diverse dimensional demands. The structure combines the light weight of Al with its particular heat transfer and heat dissipative characteristics and anti-corrosive properties of Cu, allowing it to meet the compact, thin, light-weight, and high-performance needs of electronic devices. The structure can be widely used in heat exchanges and heat transfer devices.

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“Evaluation of Brazing Properties using Al-Si-Mg-Bi Brazing Alloy—Development of Brazing Technique for Al-Cu Dissimilar Joint (Part 1)” by Ken Koyama, Kenji Shinozaki, Kenji Ikeda, Keiji Miki and Hidenori Kuroki in Keikinzokuyousetsu, vol. 40 (2002) No. 9.
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