Airflow path within an electronic module enclosure

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S679480, C361S679490, C361S679510, C361S695000, C361S724000, C454S184000, C312S236000

Reexamination Certificate

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07813120

ABSTRACT:
An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear region of the enclosure. Airflow is transferred through the electronic modules in the rear region and into the plenum.

REFERENCES:
patent: 2001/0046118 (2001-11-01), Yamanashi et al.
patent: 2002/0015287 (2002-02-01), Shao
patent: 2002/0080575 (2002-06-01), Nam et al.
patent: 2003/0030976 (2003-02-01), Garnett et al.
patent: 2003/0030978 (2003-02-01), Garnett et al.
patent: 2003/0033360 (2003-02-01), Garnett et al.
patent: 2003/0033459 (2003-02-01), Garnett
patent: 2004/0016257 (2004-01-01), Wei
patent: 2005/0015531 (2005-01-01), Yabuta et al.
patent: 2005/0217829 (2005-10-01), Belits et al.
patent: 2006/0253633 (2006-11-01), Brundridge et al.
patent: 2007/0109741 (2007-05-01), Seibold
patent: 2 378 584 (2003-02-01), None
patent: WO 03/014893 (2003-02-01), None
patent: WO 03/083631 (2003-10-01), None

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