Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1999-01-08
2000-07-25
Picard, Leo
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361687, 361694, 361696, 361700, 361703, 16510433, 174 152, 395281, 395283, H05K 720
Patent
active
060943475
ABSTRACT:
An airflow heat exchange apparatus. One embodiment includes a housing configured to removably mate with an electronic device. The housing has a vent on a substantially horizontal surface and a fan positioned to increase airflow through the electronic device when the electronic device is mated with the housing. An electronic connector is positioned to be electronically coupled to signal lines from the electronic device when the electronic device and housing are mated.
REFERENCES:
patent: 4449576 (1984-05-01), Baum et al.
patent: 5121291 (1992-06-01), Cope et al.
patent: 5159972 (1992-11-01), Gunnerson et al.
patent: 5195576 (1993-03-01), Hatada
patent: 5198889 (1993-03-01), Hisano et al.
patent: 5255109 (1993-10-01), Klein
patent: 5313362 (1994-05-01), Hatada et al.
patent: 5361188 (1994-11-01), Kondou et al.
patent: 5402312 (1995-03-01), Kinjo et al.
patent: 5409055 (1995-04-01), Tanaka et al.
patent: 5414591 (1995-05-01), Kimura et al.
patent: 5424913 (1995-06-01), Swindler
patent: 5427502 (1995-06-01), Hudson
patent: 5430609 (1995-07-01), Kikinis
patent: 5441576 (1995-08-01), Bierschenk et al.
patent: 5458189 (1995-10-01), Larson et al.
patent: 5475563 (1995-12-01), Donahoe et al.
patent: 5513070 (1996-04-01), Xie et al.
patent: 5522712 (1996-06-01), Winn
patent: 5550710 (1996-08-01), Rahamim et al.
patent: 5559673 (1996-09-01), Gagnon et al.
patent: 5559675 (1996-09-01), Hsieh et al.
patent: 5583316 (1996-12-01), Kitahara et al.
patent: 5588483 (1996-12-01), Ishida
patent: 5598320 (1997-01-01), Toedtman et al.
patent: 5621613 (1997-04-01), Hayley et al.
patent: 5646822 (1997-07-01), Bhatia et al.
patent: 5646824 (1997-07-01), Ohashi et al.
patent: 5664118 (1997-09-01), Nashigaki et al.
patent: 5694292 (1997-12-01), Paulsel et al.
patent: 5694294 (1997-12-01), Ohashi et al.
patent: 5704212 (1998-01-01), Erler et al.
patent: 5768101 (1996-12-01), Cheng
patent: 5831823 (1998-11-01), Hoedl
patent: 5884049 (1999-03-01), Atkinson
patent: 5959836 (1999-09-01), Bhatia
Datskovsky Michael
Draeger Jeffrey S.
Intel Corporation
Picard Leo
LandOfFree
Airflow heat exchanger for a portable electronic device and port does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Airflow heat exchanger for a portable electronic device and port, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Airflow heat exchanger for a portable electronic device and port will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1341084