Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2010-04-21
2011-12-06
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C415S176000, C415S203000, C415S213100, C417S423300, C454S184000, C361S694000
Reexamination Certificate
active
08072755
ABSTRACT:
An active heat-dissipating mechanism includes a fan module, an airflow-guiding part and an airflow shunt part. The fan module includes an airflow inlet and an airflow outlet. The airflow-guiding part is disposed at the same side of the airflow outlet of the fan module and in communication with the fan module. An airflow channel is defined by the airflow-guiding part. An airflow inhaled by the fan module is guided to a hotspot region of the electronic device through the airflow channel so as to remove the heat generated from the hotspot region. The airflow shunt part is formed on the airflow-guiding part. The airflow shunt part defines a stopping block in the airflow channel. A portion of the airflow is hindered by the stopping block and guided into a sub-hotspot region of the electronic device so as to remove the heat generated from the sub-hotspot region.
REFERENCES:
patent: 5218513 (1993-06-01), Brown
patent: 6021042 (2000-02-01), Anderson et al.
patent: 6220872 (2001-04-01), Chen
patent: 6704199 (2004-03-01), Wiley
patent: 7215542 (2007-05-01), Chen et al.
patent: 7218140 (2007-05-01), Young
patent: 7361081 (2008-04-01), Beitelmal et al.
patent: 7813128 (2010-10-01), Marchand
patent: 2003/0030980 (2003-02-01), Bird et al.
patent: 2006/0012957 (2006-01-01), Arbogast et al.
patent: 2008/0080143 (2008-04-01), Peng et al.
patent: 2008/0212292 (2008-09-01), Yu et al.
patent: 2008/0266792 (2008-10-01), Li et al.
Chen Chun-Chen
Wang Kuan-Sheng
Yu Wen-Lung
Delta Electronics , Inc.
Kirton & McConkie
Thompson Gregory
Witt Evan R.
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