Airbridge wiring structure for MMIC

Details Airbridge wiring structure for MMIC Airbridge wiring structure for MMIC

1996-04-09

1997-10-14

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257775, H01L 2348, H01L 2352, H01L 2940

Patent

active

056775741

ABSTRACT:
An airbridge wiring structure includes a substrate having a surface; a first wiring layer disposed on the surface of the substrate; and a second wiring layer disposed partially on the surface of the substrate and including an airbridge wiring layer crossing the first wiring layer, the first and second wiring layers being electrically insulated from each other and separated by an air gap wherein the airbridge wiring layer includes at least one longitudinal groove.

REFERENCES:
patent: 3890636 (1975-06-01), Harada et al.
patent: 4807002 (1989-02-01), Donzelli
patent: 4916520 (1990-04-01), Kurashima
patent: 4933743 (1990-06-01), Thomas et al.
patent: 5148260 (1992-09-01), Inoue et al.
patent: 5461259 (1995-10-01), Kitamura et al.
patent: 5530290 (1996-06-01), Aiken et al.
patent: 5539227 (1996-07-01), Nakano

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