Air stable copper nanoparticle ink and applications therefor

Details Air stable copper nanoparticle ink and applications therefor Air stable copper nanoparticle ink and applications therefor

2011-07-12

2011-07-12

McGinty, Douglas (Department: 1765)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C252S519400, C427S123000, C106S031130, C106S031920

Reexamination Certificate

active

07976733

ABSTRACT:
Low-cost copper nanoparticle inks that can be annealed onto paper substrate for RFID antenna applications, using substituted dithiocarbonates as stabilizers during copper nanoparticle ink production.

REFERENCES:
patent: 7749300 (2010-07-01), Chretien et al.
patent: 7789935 (2010-09-01), Chretien et al.
patent: 2003/0180451 (2003-09-01), Kodas et al.
patent: 2004/0089101 (2004-05-01), Winter et al.
patent: 2004/0175548 (2004-09-01), Lawrence et al.
patent: 2005/0078158 (2005-04-01), Magdassi et al.
patent: 2006/0053972 (2006-03-01), Liu et al.
patent: 2008/0161213 (2008-07-01), Jao et al.
patent: 2008/0164141 (2008-07-01), El-Shall et al.
patent: 2009/0274834 (2009-11-01), Chopra et al.
patent: 2009/0301344 (2009-12-01), Chretien et al.
patent: 2010/0009071 (2010-01-01), Chopra et al.
patent: 2010/0233361 (2010-09-01), Hu et al.
patent: 2010/0239750 (2010-09-01), Breton et al.
patent: 2010/0273665 (2010-10-01), Haick et al.
patent: WO 2006080318 (2006-08-01), None
CAS Reg. No. 6253-37-8, Nov. 16, 1984.
Tzhayik, O., et al., “Xanthate Capping of Silver, Copper, and Gold Colloids”, Langmuir, 18 (2002), 3364-3369.
Dhas, N. Arul et al. “Synthesis, Characterization, and Properties of Metallic Copper Nanonparticles”,Chem Mater, vol. 10, pp. 1446-1452, 1998.
Volkman, Steven K. et al. “Ink-jetted Silver/Copper conductors for printed RFID applications”,Mat. Res. Soc. Symp. Proc., vol. 814, pp. 17.8.1-17.8.6, 2004.
Jana, Nikhil R. et al., “Seed-mediated growth method to prepare cubic copper nanoparticles”,Current Science, vol. 79, No. 9, pp. 1367-1370, Nov. 10, 2000.
Wu, Chunwei et al., “Simple One-Step Synthesis of Uniform Disperse Copper Nanoparticles”,Mater. Res. Soc. Symp. Proc, vol. 879 E, pp. Z6.3.1-Z6.3.6, 2005.
Chen, Ming et al. “Phase transition of silver nanoparticles from aqueous solution to chloroform with the help of inclusion complexes ofp-sulfonated calix[4]arene and alkanethiol molecules and its application in the size sorting of nanoparticles”,Nanotechnology, vol. 18, 175706, pp. 1-7, 2007.

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