Air pocket resistant semiconductor package system

Details Air pocket resistant semiconductor package system Air pocket resistant semiconductor package system

2005-11-29

2005-11-29

Cao, Phat X. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S124000, C438S126000

Reexamination Certificate

active

06969640

ABSTRACT:
A die is attached to a substrate and is enclosed in a heat spreader, the heat spreader having a first encapsulant guide and a heat spreader air vent in the heat spreader extending therethrough. An encapsulant encapsulates the die, the substrate, at least a portion of the heat spreader, the first encapsulant guide, and the heat spreader air vent such that the encapsulant enters the heat spreader through the first encapsulant guide and air exits the heat spreader through the heat spreader air vent, thus preventing the formation of air pockets under the heat spreader.

REFERENCES:
patent: 5641987 (1997-06-01), Lee
patent: 5872395 (1999-02-01), Fujimoto
patent: 5977626 (1999-11-01), Wang et al.
patent: 6288444 (2001-09-01), Abe et al.
patent: 6534859 (2003-03-01), Shim et al.
patent: 2002/0119602 (2002-08-01), Yonemochi
patent: 2003/0134452 (2003-07-01), Mazzola et al.
patent: 2004/0043539 (2004-03-01), Lee et al.

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