Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate
2006-11-28
2006-11-28
Pham, Thanhha S. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With heat sink embedded in encapsulant
C257S706000, C257S720000
Reexamination Certificate
active
07141886
ABSTRACT:
A die is attached to a substrate and is enclosed in a heat spreader, the heat spreader having a first encapsulant guide and a heat spreader air vent in the heat spreader extending therethrough. An encapsulant encapsulates the die, the substrate, at least a portion of the heat spreader, the first encapsulant guide, and the heat spreader air vent such that the encapsulant enters the heat spreader through the first encapsulant guide and air exits the heat spreader through the heat spreader air vent, thus preventing the formation of air pockets under the heat spreader.
REFERENCES:
patent: 6654248 (2003-11-01), Fishley et al.
patent: 6720649 (2004-04-01), Huang
Dimaano Jr. Antonio B.
Do Byung Tai
Guillermo Dennis
Magno Sheila Rima C.
Ishimaru Mikio
Pham Thanhha S.
Stats Chippac Ltd.
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