Air manifold for cooling electronic components

Details Air manifold for cooling electronic components Air manifold for cooling electronic components

1993-01-21

1994-05-24

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 361692, H05K 720

Patent

active

053154797

ABSTRACT:
In a cooling system, an air manifold provides an equalized static pressure so that the air manifold evenly distributes air in a uniform basis without varying static pressures and volumes at each chip site on a printed circuit board. The air manifold is also distributes this air at the lowest possible volume so that the pumping energy required and the associated pumping noise are minimized.

REFERENCES:
patent: 3528492 (1970-09-01), Austin
patent: 4674004 (1987-06-01), Smith et al.
patent: 4851965 (1989-07-01), Gabuzda et al.
patent: 4884168 (1989-11-01), August et al.
patent: 5083194 (1992-01-01), Bartilson
patent: 5159529 (1992-10-01), Lovgren et al.
patent: 5166775 (1992-11-01), Bartilson
Brzyski et al, "Burn-In Fixture for Modules", IBM Tech. Disc. Bulletin, vol. 27, No. 7B, Dec. 1984, p. 4278.

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