Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
Patent
1990-01-16
1992-01-21
Hille, Rolf
Electricity: electrical systems and devices
Safety and protection of systems and devices
With specific current responsive fault sensor
357 74, 357 80, 357 82, 361383, 361384, 165 803, 16510433, H01L 2302, H01L 2504, H01L 3902
Patent
active
050831941
ABSTRACT:
An air-jet impingement cooling method combined with a miniature pin-fin heat sink provides equivalent fluid flow to each IC package in a module and achieves a high heat transfer rate per volume. The packaging design is comparable to high-density packaging systems utilizing low-temperature coolant.
REFERENCES:
patent: 2948518 (1960-08-01), Kraus
patent: 3065384 (1962-11-01), Sprude
patent: 3070729 (1962-12-01), Heidler
patent: 3141999 (1964-07-01), Schneider
patent: 3198991 (1965-08-01), Barnett
patent: 3417814 (1968-12-01), Oktay
patent: 3527989 (1970-09-01), Cuzner et al.
patent: 3737728 (1973-06-01), Austin
patent: 3741292 (1973-06-01), Aahallu et al.
patent: 3851221 (1974-11-01), Beaulieu et al.
patent: 3999105 (1976-12-01), Srcheyn et al.
patent: 4072188 (1978-02-01), Wilson et al.
patent: 4104700 (1978-08-01), Huthison et al.
patent: 4204247 (1980-05-01), Wrigley
patent: 4283754 (1981-08-01), Parks
patent: 4420739 (1983-12-01), Herren
patent: 4450472 (1984-05-01), Tuckerman et al.
patent: 4535385 (1985-08-01), August et al.
patent: 4536824 (1985-08-01), Barrett et al.
patent: 4578926 (1988-07-01), Herrell et al.
patent: 4628407 (1988-12-01), August et al.
patent: 4839774 (1989-06-01), Hamburger
patent: 4884168 (1989-11-01), August et al.
patent: 5014904 (1991-05-01), Morton
Computer Design, vol. 23, No. 14, Dec. 1984, AT&T Technologies, Inc., (Littleton, Mass., U.S.A.), "IBM Packs in High Desity Circuits", pp. 254-255.
IBM Technical Disclosure Bulletin, vol. 20, No. 9, pp. 3727-3728, Feb. 1978.
IBM Technical Disclosure Bulletin, vol. 21, No. 9, pp. 3591-Feb. 1979.
IBM Technical Disclosure Bulletin, vol. 8, No. 10, pp. 146, 1461, Mar. 1966.
Local Heat Transfer to Staggered Array of Inpinging Circular Array Jets-1983 Translation of ASME, vol. 105, pp. 354-359.
Heat Transfer with Impinging Jets Argon National Labs 1983, pp. 7-15.
Heat Sinks for Gate. Arrays.
Flow Visualization in an Impinging Circular Air Jet, 1989 National Heat Conference, HTD vol. 112.
Cooling of a Multichip Electronic Module by Means of Confined Two-Dimensional Jets of Dielectric Liquid, 1989 National Heat Transfer Conference, HTD, vol. 111.
Impingement Cooling of Electronics 1989 National Transfer Conference, HTD, vol. 111.
Air Jet Impingement Cooling of an Array of Simulated Electronic Packaging, 1989 National Heat Transfeer, HTD, vol. 111.
Local Heat Transfer Coefficients Under an Axisymmetric, Single-Phase Liquid Jet, 1989 Heat Transfer Conference, HTD, vol. 111.
Jet Impingement Flow Boiling of a Mixture of FC-72 and FC-87 Liquid on a Simulated Electronic Chip, 1989 National Heat Transfer, HTD, vol. 111.
Thermal Performance Characteristics of Air-Cooled Cold Plates for Electronic Cooling, 1989 National Heat Transfer, HTD, vol. 111.
Building Parallelism into the Instruction Pipeline, High Performance Systems, Dec. 1989, pp. 53-60.
"Heat Transfer From Pin-Fins Situated in an Oncoming Longitudinal Flow Which Turns to Crossflow", by E. M. Sparrow and E. D. larson, Int. J. Heat Mass Transfer, vol. 25, No. 5, pp. 603-614, 1982.
"Effect of Inlet, Exit, and Fin Geometry on Pin Fins Situated in a Turning Flow", by E. M. Sparrow et al., Int. J. Heat Mass Transfer, vol. 27, No. 27, pp. 1039-1053, 1984.
"Performance Comparisons Among Geometrically Different Pin-Fin Arrays Situated in an Oncoming Longitudinal Flow", by E. D. Larson and E. M. Sparrow, Int. J. Heat Mass Transfer, vol. 25, No. 5, pp. 723-725, 1982.
"Experimental Investigation of Multi-jet Impingement Cooling of an Array of Microelectronic Heat Sources", by L. M. Jigi and Z. Dagan, Aug. 1986.
"Thermal Impact of Double-Sided Printed Circuit Cards", by T. L. Davis.
"High-Performance Heat Sinking for VLSI", by D. B. Tuckerman and R. F. W. Pease, IEEE Electron Device Letters, vol. EDL-2, No. 5, May 1981, pp. 126-129.
"Heat Transfer in Forced Convection Through Fins", by Robert W. Keyes, IEEE Transactions on Electron Devices, vol. ED-31, No. 9, Sep. 1984, pp. 1218-1221.
"Heat-Transfer Microstructures for Integrated Circuits", by D. B. Tuckerman, Feb. 1984, Stanford Electronics Laboratories, Stanford University.
"Impingement Cooling of Electronics: Effects of Venting Through Circuit Board", by B. R. Hollworth, K. A. Maxwell, and L. S. Ukeiley, pp. 80-96, IEPS Conference (Sep. 11-18, 1989).
"Forced-Convection, Liquid-Cooled, Microchannel Heat Sinks for High-Power-Density Microelectronics", by R. J. Phillips, L. R. Glicksman, and R. Larson, pp. 295-316.
"Heat Sinks Cool Hot Computers", Tooling & Production, Jul. 1991.
Cray Research Inc.
Hille Rolf
Ostrowski D.
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