Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-03-11
2008-03-11
Chérvinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S690000, C361S697000, C361S719000, C174S016100, C174S016300, C165S080300, C165S104330
Reexamination Certificate
active
07342786
ABSTRACT:
A cooling apparatus comprises a printed circuit board and an air duct positioned adjacent the printed circuit board spanning space and forming an air-guiding channel from at least one system fan to at least one heat sink. The air-guiding channel is bounded on one side by the printed circuit board and on remaining sides by the air duct that compresses against the printed circuit board in a substantially airtight seal.
REFERENCES:
patent: 5467250 (1995-11-01), Howard et al.
patent: 5630469 (1997-05-01), Butterbaugh et al.
patent: 5691883 (1997-11-01), Nelson
patent: 5910884 (1999-06-01), Garza et al.
patent: 5917698 (1999-06-01), Viallet
patent: 5982616 (1999-11-01), Moore
patent: 6038128 (2000-03-01), Hood, III et al.
patent: 6058009 (2000-05-01), Hood, III et al.
patent: 6064571 (2000-05-01), Noble
patent: 6130819 (2000-10-01), Lofland et al.
patent: 6288895 (2001-09-01), Bhatia
patent: 6330154 (2001-12-01), Fryers et al.
patent: 6452797 (2002-09-01), Konstad
patent: 6459576 (2002-10-01), Bhatia et al.
patent: 6462948 (2002-10-01), Leija et al.
patent: 6552898 (2003-04-01), Noble
patent: 6570776 (2003-05-01), MacDonald et al.
patent: 6678157 (2004-01-01), Bestwick
patent: 6721180 (2004-04-01), Le et al.
patent: 6778390 (2004-08-01), Michael
patent: 6781834 (2004-08-01), Nair et al.
patent: 7061761 (2006-06-01), Tucker et al.
patent: 2003/0155106 (2003-08-01), Malone et al.
patent: 2006/0120039 (2006-06-01), Yuval
patent: 2006/0221591 (2006-10-01), Kong
Bolich Bryan
Malone Christopher G.
Simon Glenn C.
Tam Victoria Tsang
Chervinsky Boris
Hewlett--Packard Development Company, L.P.
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