Air distribution system

Fluid sprinkling – spraying – and diffusing – Unitary plural outlet means

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Details

98 36, 62418, A62C 3110

Patent

active

042615194

ABSTRACT:
An improved large capacity air distribution system for cooling electronic components mounted on printed circuit boards. The system has an air plenum chamber of substantially constant rectangular cross section. Openings are formed in the side walls of the chamber to permit air from within the chamber to flow outwardly in a direction substantially normal to the outer surfaces of the side walls and over the components to be cooled. A baffle in the form of a tapered wedge formed from a pair of thin metal baffle sheets is mounted in the plenum chamber so that the joined edges of the metal baffle sheets are positioned centrally in the air inlet of the chamber and the baffle is otherwise symmetrically disposed in the chamber. A large number of small round holes are formed through the sheets of the baffle, the area of the holes occupying a substantial percentage, approximately 36 percent, of the total area of the baffle. A high capacity air pump supplies air under pressure to the interior of the plenum chamber. The baffle modifies the pressure distribution and air flow within the chamber, so that the quantity of air flowing through the openings formed in the side walls per unit of time does not substantially vary with the position of the openings along the length of the plenum of such a large capacity system.

REFERENCES:
patent: 2230203 (1941-01-01), Mack et al.
patent: 3251289 (1966-05-01), Mariner
patent: 3421696 (1969-01-01), Carloni
patent: 3744724 (1973-07-01), Caille
patent: 3817160 (1974-06-01), Searcy et al.

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