Active solid-state devices (e.g. – transistors – solid-state diode – Transmission line lead
Patent
1994-09-30
1996-10-22
Jackson, Jr., Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Transmission line lead
257758, 257276, 257522, H01L 2941
Patent
active
055679820
ABSTRACT:
The present invention provides an interconnect structure which offers good mechanical stability and reduced charge concentration along the metal-insulator boundary corresponding to lower capacitance. The interconnect structure is comprised of a conductive transmission line structure and a transmission line support structure. The support structure has a "railway trestle-like" construction that provides a braced framework to support the transmission line with a greatly reduced effective dielectric constant. The trestle-like construction of the support structure is comprised of a membrane-like structure and supporting base structure separated by column-like support members. Spaces between the column-like support members form air pockets. The surface of the supporting base structure defines a horizontal axis. The long axis of the column-like support members are typically positioned at a 90 degree angle to the horizontal axis, thus defining a vertical axis support.
REFERENCES:
patent: 5391921 (1995-02-01), Kudoh et al.
Ronald R. Uttecht and Robert M. Gefken, "A Four-Level-Metal Fully Planarized Interconnect Technology for Dense High Performance Logic and SRAM Applications", Jun. 11-12, 1991 VMIC Conference, pp. 20-26.
Michael E. Thomas, Irfan A. Saadat and Satoshi Sekigahama, "Multilevel Microcoaxial Interconnect: A Novel Technology for VLSI Microwave Circuits", Jun. 11-12, 1991 VMIC Conference, pp. 116-122.
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