Air cooling for a phased array radar

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S688000, C361S692000, C361S697000, C361S707000, C361S709000, C165S080400, C165S104330, C343S771000, C343S872000, C343S878000

Reexamination Certificate

active

07898810

ABSTRACT:
In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat.

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PCT Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration mailed Apr. 2, 2010 with regard to PCT/US2009/065266 filed Nov. 20, 2009.

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