Air cooling architecture for orthogonal board architectures

Details Air cooling architecture for orthogonal board architectures Air cooling architecture for orthogonal board architectures

2007-10-09

2007-10-09

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S690000, C361S694000, C361S721000, C361S724000, C454S184000

Reexamination Certificate

active

11011838

ABSTRACT:
An electronic system is disclosed that uses air for cooling first and second orthogonally oriented arrays of parallel circuit boards. Air is drawn into the front of the system, passes alongside the circuit boards in the first array, takes a 90-degree turn, continues over the circuit boards in the second array, and takes another 90-degree turn to exhaust through the rear of the system. The circuit boards in the first array are cooled through a separate airflow path, which preferably also runs front-to-rear.

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