Air cooled multi-chip module having a heat conductive piston spr

Details Air cooled multi-chip module having a heat conductive piston spr Air cooled multi-chip module having a heat conductive piston spr

1979-06-29

1981-01-20

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 79, 357 75, 165 80D, H01L 2302, H01L 2316, H01L 2342

Patent

active

042465974

ABSTRACT:
A multi-chip module is provided having one or more cylinders formed in the module cap, each centered over the middle chip of a group of chips. Cooling fins are attached to and extend from each of the cylinders. A heat conductive piston is located in each of the cylinders forming a small interface between the piston and the cylinders and the piston and the middle chip. The heat conductive piston is spring loaded against the chips. A heat conductive conformal surface flange extends radially from the outer end of each of the pistons so as to have portions thereof contacting adjacent chips in the group of chips, thereby providing parallel conduction cooling from the adjacent chips to the central heat conductive piston. Heat conductive spring means are included between the module caps and the flange for providing a seating force of the flange against the chips and providing an additional heat transfer path from the chip.

REFERENCES:
patent: 3719862 (1973-03-01), Gaicki
patent: 3723836 (1973-03-01), Shekerjian
patent: 3972012 (1976-07-01), Liu
patent: 4067042 (1978-01-01), Novak et al.
patent: 4167771 (1979-09-01), Simons
patent: 4203129 (1980-05-01), Oktay et al.
IBM Technical Disclosure Bulletin; Cooling Assembly for Integrated Circuit Chip by Lynch, vol. 20, No. 1, Jun. 1977, p. 143.

Affiliated with

Also associated with

Rating

Air cooled multi-chip module having a heat conductive piston spr does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Air cooled multi-chip module having a heat conductive piston spr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Air cooled multi-chip module having a heat conductive piston spr will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1769956