Air-cooled hybrid electronic package

Details Air-cooled hybrid electronic package Air-cooled hybrid electronic package

1979-12-26

1981-09-22

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 80E, H05K 720

Patent

active

042913640

ABSTRACT:
Metallized ceramic modules (MC), which are mounted on printed circuit cards, and multi-layer ceramic modules (MLC), which are mounted on a printed circuit planar board, are combined into one hybrid package. An air cooling distribution system is provided wherein air is first caused to impinge against the multi-layer ceramic modules after which it is directed to flow serially across the metallized ceramic modules.

REFERENCES:
patent: 3923466 (1975-12-01), Seelig
IBM Tech. Discl. Bull. vol. 22, No. 2, Jul. 1979, pp. 696, 697, Push-Pull Multi-Flow System-, Hwang and Simons.
Planar Heat Exchanger, Moran & Simons, IBM Tech. Discl. Bull. vol. 22, No. 2, Jul. 1979, pp. 698, 699.
IBM Tech. Discl. Bull., Thermally Enhanced Multilayer Ceramic Substrate, Kerjilian, vol. 18, No. 2, Jul. 1975, p. 353.

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