Air-cooled heat exchanger for electronic circuit modules

Details Air-cooled heat exchanger for electronic circuit modules Air-cooled heat exchanger for electronic circuit modules

1989-09-08

1991-06-04

Hepperle, Stephen M.

Heat exchange

With retainer for removable article

Electrical component

165185, 361383, 361384, F28F 306, H05K 720

Patent

active

050205862

ABSTRACT:
Apparatus for cooling an electronic circuit module includes a heat sink in thermal contact with the circuit module and a device for directing cooling gas at the heat sink. The heat sink includes multiple fins defining channels between them, a base having a surface for contact with the circuit module, and a plurality of passages located between the fins and the base and interconnecting with the channels. At least a part of the cooling gas flows between the fins and absorbs thermal energy from the fins and then flows through the passages and absorbs additional thermal energy. The fins and the passages provide a large area of contact with the cooling air and reduce the pressure drop through the heat sink. The heat sink provides a path for efficient conduction of thermal energy from the circuit module to the fins and prevents the formation in the cooling air of recirculating eddies which can reduce heat transfer.

REFERENCES:
patent: 3416597 (1968-12-01), Kupferberg
patent: 3593064 (1971-07-01), Wagner et al.
patent: 4296455 (1981-10-01), Leaycraft et al.
patent: 4369838 (1983-01-01), Asanuma et al.
patent: 4682651 (1987-07-01), Gabuzda
patent: 4768581 (1988-09-01), Gotwald et al.
Horvath, J. L., "Cooling Fin Structure", IBM Technical Disclosure Bulletin, Jul. 1980, vol. 23, No. 2, pp. 603-604.
Goldberg, IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. CHMT-7, No. 1, Mar. 1984, pp. 154-159.
Tuckerman et al, IEEE Electron Device Letters, vol. EDL-2, No. 5, May 1981, pp. 126-129.

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