Air conditioner with heat pipe

Refrigeration – Using electrical or magnetic effect – Thermoelectric; e.g. – peltier effect

Reexamination Certificate

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Reexamination Certificate

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06807811

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to an improved air conditioner and heater with an improved heat pipe array thermally connected to a pre-selected number of thermoelectric modules. The air conditioner may include a heater component.
BACKGROUND OF THE INVENTION
Conventional cooling systems using thermoelectric modules suffer from various limitations and relatively low heat transfer efficiency. By way of example, Korean patent 2000-54406 is an example of an earlier cooling system using a thermoelectric module and conventional heat transfer arrangement. An example of another earlier heat transfer system employing a heat transfer pipe without thermoelectric module components, is described in Korean patent number 190443. Other examples of earlier systems include: U.S. Pat. No. 6,354,086 to Inoue et al., U.S. Pat. No. 5,232,516 to Hed, U.S. Pat. No. 5,269,146 to Kerner, U.S. Pat. No. 5,540,567 to Schirpke et al., U.S. Pat. No. 5,653,111 to Attey et al., and U.S. Pat. No. 5,675,973 to Dong. The foregoing examples describe conventional fluid pumping and piping systems for transportation of fluid within the heat transfer or cooling systems described in those patents.
Some of the earlier systems have attempted to improve the efficiency of heat exchange by incorporating complex fluid agitators. U.S. Pat. No. 6,354,086 to Inoue et al. is an example of an earlier patent in which such agitators are described. U.S. Pat. No. 5,269,146 describes a closed system heating and cooling system for thermally insulated containers such as portable refrigerated chests, heated bottles and serving carts for hotels and restaurants. Thermally conductive fluid is circulated through a closed loop circulating system. The heated or cooled fluid is passed through an air core heat exchanger for heat exchange with surrounding ambient air. The patent describes that the fluid is pumped at high speeds through the closed system to promote efficient heat transfer.
These earlier systems have not addressed the advantages of providing heat exchange systems having the improved efficiencies associated with harnessing the natural forces and inherent fluid flow characteristics of the capillary flow systems described below.
SUMMARY OF THE INVENTION
Many of the earlier, conventional heat transfer systems do not provide for an efficient structure or method for distributing the cooling effect of thermoelectric modules provided in cooling systems such as cooling-type air conditioners. The overall efficiency of the cooling device depends to a substantial part upon the ability of the device to effectively utilize the cooling power of the array of thermoelectric modules. In effect, it is desirable to provide a system in which there is an efficient heat transfer interface between the cooling faces of the thermoelectric modules and the circulatory system to distribute the “cold supply” furnished by the cooling faces of the thermoelectric modules.
In one aspect of the invention, a cooling manifold is used in which the manifold comprises an upper cylinder, a lower cylinder and a plurality of vertically arranged heat pipes providing fluid communication between the upper and lower cylinders. Each of the heat pipes is a generally, planar, elongated member extending between the upper and lower cylinders. The manifold defines an interior volume for closed circulation of a thermally conductive fluid. In a preferred embodiment, the upper and lower cylinders and interconnecting heat pipes define a generally vertical plane when the manifold is installed for operation.
A pre-selected number of thermoelectric modules are arranged for thermal communication with the upper cylinder. The upper cylinder defines a surface to thermally communicate with an aligned array of thermoelectric modules presented so that their cooling faces are in thermal communication with the upper cylinder of a cooling manifold. The interior volume of the manifold will be charged with a suitable thermally conductive fluid that will circulate within the internal volume during operation of the air conditioning device. The heat pipes define a plurality of vertically arranged, elongated capillaries that allow fluid communication of the thermally conductive fluid between the upper and lower cylinders of the self contained manifold. The thermally conductive fluid contained within the manifold will tend to flow within the internal channels of the heat pipes due in part to the cooling effect upon the fluid caused by the heat transfer process affected between the cooling faces of the thermoelectric modules and the upper cylinder of the manifold. In addition, the thermally conductive fluid will tend to flow in part due to the capillary action exerted on the fluid charged within the interior volume of the manifold, and extending within the capillaries of the heat pipes. One of the advantages of the invention is that it is unnecessary to provide a circulating pump to circulate a thermally conductive fluid within the interior chamber of the heat pipes. Although there may be instances where a circulating pump may be added for that purpose, such a pump would not be necessary to circulate the thermally conductive fluid filled within the interior volume of the upper cylinder, heat pipes and lower cylinder.
During assembly, an access port (not shown) may be provided on the manifold to evacuate entrapped air from within the internal chambers of the lower cylinder, upper cylinder and capillaries within the heat pipes. In a preferred embodiment, the interior chamber of the heat pipes is drained of entrapped air so a substantial vacuum is created. Thereafter, the interior chamber of the lower cylinder, upper cylinder and capillaries of the heat pipes are filled with an effective amount of the thermally conductive fluid until a substantial portion of the interior volume of that structure is filled with a liquid phase of the thermally conductive fluid. The remaining portion of the interior volume is filled with the vapor phase of the selected thermally conductive fluid. After the manifold is charged with the appropriate fluid, the access port may be closed by applying a suitable stopper or cap.
As noted above, a thermally conductive fluid is provided within the enclosed fluid reservoir of the manifold. Heat exchange occurs through the operation of the thermoelectric modules and the repeated evaporation and condensation of the thermally conductive fluid within the fluid reservoir of the manifold.
In a preferred embodiment, the fluid within the interior volume is filled until the liquid phase occupies about 40% to 70% of that interior volume. The vapor phase will occupy between about 30% and 60% of that interior volume, in a preferred embodiment. These amounts are preferred charging ratios. However, other operatively effective amounts may be chosen to meet selected design criteria.
In a further preferred embodiment of the invention, the capillary channels in a heat pipe are generally rectangular tubes defined by the interior walls of each heat pipe. Preferably, the interior walls extend orthogonally from one face of the heat pipe to the opposing face of the heat pipe. However, the capillaries may be manufactured to have other cross-sectional configurations that are not necessarily square or rectangular in shape. The relative size of the capillaries may vary according to the design requirements and characteristics of the desired heat exchange system. In a preferred system directed to the use of water based thermally conductive fluid systems, the diameter of the capillaries will typically range below about 4 mm. In some instances, it may be desirable to provide additives or other fluids to enhance the physical properties of the fluid circulating within the capillaries. Consequently, the diameter of the capillaries may be adjusted to accommodate the particular characteristics of a specific fluid selected for use in the system.
In another preferred embodiment, the capillaries are arranged in a single layer of capillaries within the outer walls of a given heat pipe. In other instances, mu

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