Air cavity plastic package for high frequency optical devices

Details Air cavity plastic package for high frequency optical devices Air cavity plastic package for high frequency optical devices

2006-10-05

2009-02-03

Doan, Jennifer (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S053000, C385S088000, C385S092000

Reexamination Certificate

active

07484900

ABSTRACT:
The present invention generally relates to an air cavity plastic package for a high frequency optical device. In one aspect, a module package for a high frequency optoelectronic device is provided. The module package includes an upper plastic housing having an upper cavity formed therein and a lower plastic housing having a lower cavity formed therein. The upper housing and the lower housing are configured to mate together such that the cavities form an enclosed air cavity between the housings. Additionally, upon creating a seal between the housings, an optical feed through is realized. The module package further includes a plurality of conductors disposed in the lower housing, each conductor having an upper end and a lower end, wherein the upper end is connectable to a chip disposed in the air cavity and the lower end is connectable to a board. In another aspect, a method of packaging and assembling a high frequency optical device is provided. In yet another aspect, a package assembly for an electro-optical modulator is provided.

REFERENCES:
patent: 4953001 (1990-08-01), Kaiser et al.
patent: 5664043 (1997-09-01), Donaldson et al.
patent: 2002/0190359 (2002-12-01), Shaw et al.
patent: 2005/0058411 (2005-03-01), Finot et al.

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