Air bridge structures and methods of making and using air...

Details Air bridge structures and methods of making and using air... Air bridge structures and methods of making and using air...

2006-05-09

2008-10-28

Cosimano, Edward R (Department: 2863)

Data processing: measuring, calibrating, or testing

Testing system

C257SE21573, C257SE23170, C257SE23169, C324S763010, C702S057000, C702S117000

Reexamination Certificate

active

07444253

ABSTRACT:
A probe card assembly, according to some embodiments of the invention, can comprise a tester interface configured to make electrical connections with a test controller, a plurality of electrically conductive probes disposed to contact terminals of an electronic device to be tested, and a plurality of electrically conductive data paths connecting the tester interface and the probes. At least one of the data paths can comprise an air bridge structure trace comprising an electrically conductive trace spaced away from an electrically conductive plate by a plurality of pylons.

REFERENCES:
patent: 2851660 (1958-09-01), Tobin et al.
patent: 2877544 (1959-03-01), Gammel
patent: 2954521 (1960-09-01), McKee
patent: 3082374 (1963-03-01), Buuck
patent: 3567914 (1971-03-01), Neese et al.
patent: 4761303 (1988-08-01), Ruszczyk et al.
patent: 4920639 (1990-05-01), Yee
patent: 5476211 (1995-12-01), Khandros
patent: 5529634 (1996-06-01), Miyata et al.
patent: 5839188 (1998-11-01), Pommer
patent: 5869354 (1999-02-01), Leedy
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5974662 (1999-11-01), Eldridge et al.
patent: 5994152 (1999-11-01), Khandros et al.
patent: 6033935 (2000-03-01), Dozier et al.
patent: 6221750 (2001-04-01), Fjelstad
patent: 6246014 (2001-06-01), Pommer
patent: 6255126 (2001-07-01), Mathieu et al.
patent: 6336269 (2002-01-01), Eldridge et al.
patent: 6441315 (2002-08-01), Eldridge et al.
patent: 6509751 (2003-01-01), Mathieu et al.
patent: 6605825 (2003-08-01), Brar et al.
patent: 6640432 (2003-11-01), Mathieu et al.
patent: 6827584 (2004-12-01), Mathieu et al.
patent: 6849308 (2005-02-01), Speakman et al.
patent: 6945827 (2005-09-01), Grube et al.
patent: 7223696 (2007-05-01), Leedy
patent: 7242012 (2007-07-01), Leedy
patent: 2001/0012739 (2001-08-01), Grube et al.
patent: 2001/0044225 (2001-11-01), Eldridge et al.
patent: 2003/0151046 (2003-08-01), Brar et al.
patent: 2004/0016119 (2004-01-01), Eldridge et al.
patent: 2005/0089635 (2005-04-01), Hasei
patent: 2007/0141743 (2007-06-01), Mathieu et al.
patent: 2008/0088010 (2008-04-01), Hobbs et al.
patent: 2004-165310 (2004-06-01), None
IBM Technical Disclosure Bulletin: “Intertwined Integrated Circuit Testing Chain”, Feb. 1, 1986, vol. 28, No. 9, pp. 3959-3960.
“ProMetal 3-D Printing Process,” ProMetal division of The Ex One Company (Irwin, Pennsylvania), 2 pages, date of first publication unknown, submitted pages printed from .prometal.com/process.html on Apr. 20, 2006.
“ProMetal Equipment,” ProMetal division of The Ex One Company (Irwin, Pennsylvania), 2 pages, date of first publication unknown, submitted pages printed from .prometal.com/equipment.html on Apr. 20, 2006.
“Welcome to the ink-jet age” ZDNet.co.uk of CNET Networks, 5 pages, submitted pages printed from news.zdnet.co.uk.
“Epson Inkjet Technology Used to Fabricate World's First Ultra-Thin Multilayer Circuit Board”, News Release, Nov. 1, 2004, 2 pages, submitted pages printed from .epson.co.jp.
Butterfield, “The Print Shop: Sci-Fi Inkjet Printers” on-line article, Mar. 1, 2005, 2 pages, submitted pages printed from .pcworld.com.
Canny et al., “Flexonics,” Electrical Engineering and Computer Sciences, University of California, Berkeley, pp. 1-17, Dec. 14-17, 2002.
Gay, “Direct Writing Global status and opportunties for the UK in advanced manufacturing,” Crown, Feb. 2004, pp. i-vii and 1-1 through 6-1.
Graham-Rowe, “‘Gadget printer’ Promises industrial revolution,” New Scientist, 2 pages, Jan. 2003.
Lipson, “Homemade,” IEEE Spectrum, pp. 24-31, May 2005.
Nozawa, “Epson Prints 20-Layer Board with Inkjet Technology” Feb. 2005, Nikkei Electronics Asia, Nikkei Business Publications, Inc., submitted pages printed from .techhon.nikkeibp.co.jp.
Wohlers, “A Year Filled With Promising R&D,” Time-Compression.
Technologies Magazine, 4 pages, Nov./Dec. 2002, Wohlers Associates.

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