Electric heating – Heating devices – Combined with diverse-type art device
Reexamination Certificate
2000-07-21
2002-05-07
Jeffery, John A. (Department: 3742)
Electric heating
Heating devices
Combined with diverse-type art device
C219S385000, C324S1540PB
Reexamination Certificate
active
06384377
ABSTRACT:
BACKGROUND OF THE INVENTION
This invention relates to an aging socket and an aging cassette suitably applied to a small electronic part such as a semiconductor laser device and an aging device for performing aging for a small electronic part.
An aging socket, an aging cassette and an aging apparatus which are conventionally known are shown in
FIGS. 7
to
13
B.
First, a semiconductor laser coupler which is one of aging object parts to be aged is described briefly with reference to FIG.
7
.
The semiconductor laser coupler D shown is constructed such that a laser device body mounted on a circuit board is accommodated in a package
1
of a shape of a parallelepiped which has an opening
2
at a central portion of the top thereof while a pair of wedge-shaped notches
3
are formed in the middle of a pair of opposing sides thereof such that a laser beam is emitted from the opening
2
and then introduced into the opening
2
after it is reflected by a reflecting object so that some signals may be detected by the semiconductor laser coupler D.
An aging apparatus and an aging cassette are shown in
FIGS. 8 and 9
, respectively. Referring to
FIGS. 8 and 9
, the aging cassette (hereinafter referred to merely as “cassette”)
20
and the aging apparatus
10
are used such that the semiconductor laser coupler D as described above with reference to
FIG. 7
is placed onto the cassette
20
and then the cassette
20
is placed onto the aging apparatus
10
and then heated to a temperature of 60° C. to 70° C. to evaluate a condition of deterioration of various characteristics of the semiconductor laser coupler D.
The aging apparatus
10
includes a housing
11
of a large size and has a constant temperature bath function of keeping the inside thereof constant at the temperature mentioned above. The inside of the aging apparatus
10
is partitioned like a matrix to form a plurality of slots
12
therein. Further, though not shown, a common heater and fan are built in the aging apparatus
10
such that hot air heated by the heater is blasted into the inside of the housing
11
to simultaneously heat all cassettes
20
accommodated in the slots
12
to a substantially equal temperature while the temperature is controlled so as to be fixed by a temperature regulator also which is built in the aging apparatus
10
. Further, the aging apparatus
10
has a front panel section
13
on the right side in
FIG. 8
, and a temperature display apparatus
14
and a power supply switch
15
are provided at an upper portion of the front panel section
13
. Further, a circuit breaker
16
and so forth are provided at a lower portion of the front panel section
13
.
It is to be noted that, although, during aging of the aging apparatus
10
, the front of the aging apparatus
10
is closed up with a door to keep the inside of the aging apparatus
10
at the constant temperature, in
FIG. 8
the aging apparatus
10
is shown with the door removed. Further, in
FIG. 8
, the aging apparatus
10
is shown in a state wherein the cassette
20
shown in
FIG. 9
is inserted in each of the slots
12
described above.
The cassette
20
is formed in such a structure as shown in
FIGS. 9
to
12
. Referring to
FIGS. 9
to
12
, the cassette
20
includes a body
21
and a lid member
22
connected to each other by a pair of hinges
23
. The body
21
receives a plurality of semiconductor laser couplers D as aging object parts thereon, and the lid member
22
has a plurality of light receiving elements R, which each receives a laser beam, incorporated therein corresponding to the semiconductor laser couplers D.
While
FIG. 9
shows the cassette
20
where semiconductor laser couplers D are mounted on the body
21
, each of the semiconductor laser couplers D is received in a socket
30
shown in
FIGS. 10
to
13
B. Before the structure of the socket
30
is described, the structure of the cassette
20
is described. A plurality of sockets
30
are incorporated in an arrangement of a matrix on a face of the body
21
of the cassette
20
which opposes to the lid member
22
. A power supply electrode, a ground electrode and a signal transmission/reception electrode are incorporated in each of the sockets
30
, and the electrodes of the sockets
30
are connected to an electronic circuit board
24
disposed below the sockets
30
. Part of the electronic circuit board
24
is led out toward the hinged side
23
of the cassette
20
and serves as a plug-in terminal
24
A when the cassette
20
is inserted into a slot
12
of the aging apparatus
10
.
Meanwhile, a plurality of circular holes
25
are formed at portions of a surface of the lid member
22
adjacent the body
21
in an opposing relationship to the sockets
30
. Further, a hold down plate
26
is disposed on the surface of the lid member
22
adjacent the body
21
such that it can hold down the semiconductor laser couplers D when the lid member
22
is closed while the semiconductor laser couplers D are received in the socket
30
, and the light receiving elements R are disposed in the circular holes
25
. Also various electrodes of the light receiving elements R are connected to an electronic circuit of a electronic circuit board
27
disposed behind them. Part of the electronic circuit board
27
is led out to the hinged side
23
of the cassette
20
similarly and serves as another plug-in terminal
27
A when the cassette
20
is inserted into a slot
12
of the aging apparatus
10
.
A U-shaped handle
28
A is mounted on an end face of the body
21
remote from the hinges
23
, and another U-shaped handle
28
B of an equal size is mounted on a corresponding end face of the lid member
22
.
The socket
30
is particularly shown in
FIGS. 13A and 13B
. Referring to
FIGS. 13A and 13B
, the socket
30
has a cylindrical portion
31
of a comparatively great thickness at a central portion thereof. An upper flange
32
in the form of a disk having a comparatively small thickness is formed horizontally at an upper end of the cylindrical portion
31
, and a mounting flange
33
in the form of a disk having a comparatively great thickness is formed horizontally at a lower end of the cylindrical portion
31
. Consequently, the socket
30
is formed as a base
34
of a tubular structure having a U-shaped cross section. A pair of electrode pins
36
A and
36
B are positioned in an opposing relationship on an inner circumferential face of a hollow portion
35
of a horizontally circular section at a central portion of the base
34
and are led out downwardly of the base
34
from a receiving face of the base
34
for a semiconductor laser coupler D.
Further, a pair of positioning pins
37
A and
37
B are embedded in the base
34
such that they are held in contact with outer arcuate faces of the electrode pins
36
A and
36
B and extend upwardly a little above the top face of the base
34
. The distance between inner arcuate faces of the positioning pins
37
A and
37
B is set corresponding to the distance between the pair of notches
3
formed on the package
1
for a semiconductor laser coupler D.
Four fixing screws
38
are formed in the mounting flange
33
, and four through-holes
39
are formed in the upper flange
32
and positioned above the mounting flange
33
. Thus, a screwdriver may be inserted in any of the through-holes
39
and screw a fixing screw into the fixing screw
38
to fasten the base
34
to a mounting member of the body
21
side. In
FIGS. 13A and 13B
, a semiconductor laser coupler D is shown mounted on the socket
30
.
The conventional aging apparatus
10
and cassette
20
are constructed in such structures as described above. In order to perform aging of semiconductor laser couplers D using the aging apparatus
10
and the cassette
20
, the lid member
22
of the cassette
20
is opened first, and a semiconductor laser coupler D is placed into each of the sockets
30
disposed on the body
21
of the cassette
20
such that the positioning pins
37
A and
37
B are inserted into the notches
3
of the semiconductor laser coupler D until th
Jeffery John A.
Kananen, Esq. Ronald P.
Rader & Fishman & Grauer, PLLC
Sony Corporation
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