Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-06-28
2004-03-09
Vigushin, John B. (Department: 2827)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S766000
Reexamination Certificate
active
06704209
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to an aggregate (cluster) of electronic components in which electronic components including an element and an electronic component are aggregated in a predetermined number and a mounting method thereof, and a mobile device comprising the aggregate of electronic components.
Recently, mobile devices represented by a telephone are on the way toward a reduction in weight and in size. Accordingly, the electronic circuit substrate incorporated in the mobile device is getting denser in the mounting of the electronic components while the electronic components used therein are also getting finer.
In order to mount the electronic components on the circuit substrate, gaps are required between the electronic components without fail. Since these gaps become extremely small as a result of said increase in density, there is a limit in the adjacent gaps in individually mounting even electronic components reduced in size in any way. Furthermore, there are various differences among the electronic components not only in size but also in height. In the case of correcting a mounting error which occurs easily as smaller adjacent gaps, when an electronic component is mounted again around higher electronic components than it, tools such as suction nozzle or the like for holding and handling electronic components are likely to interfere with the higher electronic components, which makes the work difficult and long or causes work failure or work malfunction, so that the electronic circuit substrate in process may become defective.
Furthermore, even when the electronic components are reduced to any small size, the number of electronic components to be mounted for manufacturing electronic circuit substrate remains the same, so that productivity is not improved. With greater difficulty in the mounting of the electronic components, the productivity and yield are lowered on the contrary.
On the other hand, Japanese Unexamined Patent Publication No. 06-251993 (1) and Japanese Unexamined Patent Publication No. 11-40459 (2) disclose technologies for dealing with the issue described above. As shown in
FIG. 9
, the technology described in the above publication (1) is such that each of flat plate-like chip bodies
100
a
forming elements with different electric functions such as a capacitor and/or a resistor, or elements with the same type of function are connected or joined in a row via an organic adhesive
100
c
which can disappear at the time of solder joining and inorganic adhesive
100
d
insolvent or undissolved at a solder joining temperature, allowing the sides with no outer electrode
100
b
formed to be faced each other. The technology described in the publication (2) is such that each terminal electrode of chip electronic components, adjacent to each other when the sides of the chip electronic components in rectangular parallelepiped configuration are allowed to adhere to each other, is provided on each end portion of the chip electronic components with the predetermined interval, and a plurality of the chip electronic components are allowed to adhere to each other at the side surfaces with adhesive to form one row, maintained integrally.
According to the technology described above, since a plurality of chip electronic components are integrally handled and mounted in the number of the electronic components connected in a row, so that the difficulty in mounting of the electronic components resulting from the miniaturizations can be avoided. At the same time, the required times of the mounting work for the required number of the components is decreased, so that the productivity and the yield can be improved.
However, when the electronic components individually formed are respectively connected to each other, like the aggregate of electronic components described in the publications (1) and (2), work to connect a plurality of electronic components is required in addition to the manufacture of individual electronic components, and the connection work becomes more difficult with the miniaturization of the electronic components. It is also necessary to consider at least that the mounting surfaces for the individual electronic components form a planar surface to connect the individual electronic components. Such connection of the components is favorable for the mounting thereof, but unfavorable for the manufacture of the components, and the cost of components comes high.
In the aggregate of electronic components described in the publications (1) and (2), only sides with no electrodes can be connected to each other, so that a row is inevitably formed as described above, where an arrangement of aggregated electronic components and an arrangement at the time of mounting the aggregate of electronic components on the circuit substrate have a small degree of freedom, which is inconvenient. Thus, in some cases, mounting in a high density cannot be provided.
Even if the aggregate of electronic components as described in the publications (1) and (2) can be mounted in a high density, all the individual electronic components themselves forming the aggregate of electronic components are mounted facing the circuit substrate, so that the mounting density of individual electronic components cannot be improved.
An object of the present invention is to provide an aggregate of electronic components favorable for the improvement of the mounting work and the mounting density and a mounting method thereof, and a mobile device by the method.
SUMMARY OF THE INVENTION
In order to attain the above object, an aggregate of electronic components according to the present invention is characterized in that three or more electronic components including an element and an electronic component are formed on one substrate, and these electronic components form an aggregated planar surface on the surface of the substrate. That is, there is provided an aggregate of electronic components comprising:
one substrate; and
three or more electronic components including an element and an electronic component, formed on the one substrate, forming an aggregated planar surface on a surface of the substrate.
In such a structure, since the electronic components including an element and an electronic component are formed on one substrate, there is no difficulty in the handling and arrangement works due to a small size of individual electronic components, as seen in the case that finished electronic components are individually handled and mounted, or connected, so that three or more electronic components are arranged up to the limit of electric characteristic such as insulation in a high density in various patterns considering the type, the configuration, and the size, and the aggregate can be manufactured at cheaper cost. At the same time, each of the arranged electronic components forms an aggregated planar surface on the surface of the substrate, and the whole of the substrate and the electronic components can be formed in a desired planar configuration and size, easily having the mounting surface of one planar surface in the form handled in the same way as normal chip electronic components. Consequently, handling and mounting the electronic components become easy and the lowering of the yield due to a mounting error can be settled, thereby, along with a high degree of freedom in the arrangement, the mounting of the electronic components in high density is facilitated to improve the mounting density as a whole.
Furthermore, depending on the combinations of the heights of the electronic components and the thickness of the substrate and the thickness of the position of individual electronic components on the substrate, the height of the whole of the substrate and the electronic components is uniformed with respect to the different types, avoiding the deterioration in the work efficiency before and after the mounting of the electronic components to provide convenience in the correction of the mounting, while an aggregated planar surface is formed, even in the case of a combination in which electronic c
Yamamoto Minoru
Yamauchi Hiroshi
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