Metal treatment – Stock – Noble metal base
Patent
1983-05-12
1985-02-19
Smith, John D.
Metal treatment
Stock
Noble metal base
75951, 427 79, 419 21, 428403, H01G 101
Patent
active
045003688
ABSTRACT:
Pure silver and palladium powders are thoroughly mixed and dispersed by ball milling in a solution of a surfactant in a liquid vehicle. After drying and granulating, the resulting powder was heated to 500.degree. C., first to form an Ag/Pd alloy powder and then to cause palladium to precipitate from the interior of the alloy particles, to form a protective barrier of PdO on the alloy particle surfaces and to alter the alloy to 90Ag/10Pd. This powder, when used to make a buried electrode in a ceramic capacitor changes dimensions very little up to 500.degree. C. in the early stage of sintering the ceramic below which temperature the ceramic is weakest and most subject to cleaving.
REFERENCES:
patent: 3337365 (1967-08-01), Mones
patent: 3554796 (1971-01-01), Liederbach
patent: 3815187 (1911-06-01), Hanold
patent: 3988498 (1976-10-01), Maher
patent: 4082906 (1978-04-01), Amin
patent: 4192698 (1980-03-01), Maher
patent: 4266265 (1981-05-01), Maher
patent: 4426356 (1984-01-01), Nair
Anjard & Kirschenman, Quality Program for Thick Film Pastes and Ingredients used in Microelectronics and in the Electronics Industry in General, 1982 International Electronic Packaging Society, pp. 555-576.
Abe et al., "Development of Thick-Film Capacitor . . . " IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-2, No. 4, Dec., 1979, pp. 434-441.
Smith John D.
Sprague Electric Company
LandOfFree
Ag/Pd electroding powder and method for making does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ag/Pd electroding powder and method for making, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ag/Pd electroding powder and method for making will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-611680