Aerodynamically enhanced heat sink

Details Aerodynamically enhanced heat sink Aerodynamically enhanced heat sink

1982-11-24

1985-09-10

James, Andrew J.

357 68, H01L 2336, H01L 2314

Patent

active

045410046

ABSTRACT:
An aerodynamically enhanced heat sink is disclosed, which heat sink includes a plurality of metallic pins each having one end thereof affixed to the integrated circuit package and the second end thereof being disposed for heat dissipation. The plurality of pins are made of varying lengths such that a partial hemisphere is formed with the second ends thereof.

REFERENCES:
patent: 2756374 (1956-07-01), Colleran et al.
patent: 3421578 (1969-01-01), Marton
patent: 4103737 (1978-08-01), Perkins
"Thermally Enhanced Multilayer Ceramic Substrate Structure", Kerjilian et al., vol. 18, No. 2-7, 1975, pp. 353-354, IBM Technical Disclosure.
"Semiconductor Package with Improved Cooling", Berndlmaier et al., IBM Tech. Disclosure, pp. 3452-3453, vol. 20, No. 9, Feb. 1978.

Affiliated with

Also associated with

Rating

Aerodynamically enhanced heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Aerodynamically enhanced heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Aerodynamically enhanced heat sink will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1431668