Advanced workpiece finishing

Details Advanced workpiece finishing Advanced workpiece finishing

2006-03-03

2009-08-18

Eley, Timothy V (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S041000, C702S179000, C702S182000

Reexamination Certificate

active

07575501

ABSTRACT:
An apparatus for processing, finishing, and planarizing is disclosed. A methods of processing are disclosed. New methods of control for processing are disclosed. The methods and apparatus, can help improve yield and lower the cost of manufacture for planarizing of workpieces having extremely close tolerances such as semiconductor wafers. Cost of manufacture parameters are used for control. Methods to determine preferred changes to process control parameters are disclosed. Use of a model for improving manufacture, cost of manufacture, and profitability is discussed.

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