Advanced process control for low variation treatment in...

Details Advanced process control for low variation treatment in... Advanced process control for low variation treatment in...

2007-12-25

2007-12-25

Norton, Nadine (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

C438S008000, C436S055000

Reexamination Certificate

active

11429572

ABSTRACT:
The variability of immersion processes for treatment of semiconductor devices can be significantly lowered by initiating the termination of a treatment process according to a predetermined treatment termination protocol in a manner that takes into account the contribution of, in particular, the treatment that is carried out during the period of time in the treatment process in which the treatment process is being terminated. In a preferred embodiment, conditions that indicate the progress of the treatment on a real time basis are monitored, and the timing of the initiation of the termination process is additionally based on the calculated amount of treatment and treatment rate of the process in progress.

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