Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1990-05-10
1991-09-24
Picard, Leo P.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
361395, H05K 502, H05K 506, H05K 702
Patent
active
050518690
ABSTRACT:
An advanced co-fired multichip hybrid package comprises a castellated base, each castellation leading to a pad. An insulated wall rises from the leads, but not from the pads, and is topped by a kovar sealing ring and a layer of solder. A board of chips or other electronic components has a plurality of metallized vias extending therethrough, each via being in registration with a pad and having a ball of solder placed in it. A kovar lid is placed on the wall, and the entire apparatus is fired and cooled. The solder on the wall seals the lid to the wall, and the solder ball in each via bonds the board both mechanically and electrically to the base. No wire bond is needed.
REFERENCES:
patent: 3916434 (1975-10-01), Garboushin
patent: 4076955 (1978-02-01), Gates, Jr.
patent: 4100589 (1978-07-01), McGann
patent: 4105861 (1978-08-01), Hascoe
patent: 4208698 (1980-06-01), Narasimhan
patent: 4266089 (1981-05-01), Scherer
patent: 4266090 (1981-05-01), Scherer
patent: 4272644 (1981-06-01), Visser et al.
patent: 4288841 (1981-09-01), Gogal
patent: 4291815 (1981-09-01), Gordon et al.
patent: 4331253 (1982-05-01), Gordon et al.
patent: 4332341 (1982-06-01), Minetti
patent: 4352449 (1982-10-01), Hall et al.
patent: 4356047 (1982-10-01), Gordon et al.
patent: 4372037 (1983-02-01), Scapple et al.
patent: 4423468 (1983-12-01), Gatto et al.
patent: 4445633 (1984-05-01), Bonham, Jr.
patent: 4471259 (1984-09-01), Stoermer et al.
patent: 4477828 (1984-10-01), Scherer
patent: 4491622 (1985-01-01), Butt
patent: 4506108 (1985-03-01), Kersch et al.
patent: 4547624 (1985-10-01), Town et al.
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 4577056 (1986-03-01), Butt
Chip Carrier Offers Microcircuit Gains--Aviation Week and Space Technology, Jan. 24, 1977.
Custom-Design Microcircuit Costs Cut--Aviation Week and Space Technology, Feb. 14, 1977.
Cures Sought for Parts Contamination--Aviation Week and Space Technology, Apr. 11, 1977.
Flip TAB, Copper Thick Films Create the Micropackage--Electronic/Nov. 3, 1982.
Batch-Made Packages Hold Dense ICs, Save Space, Survive Tough Environments--Electronics/Apr. 21, 1983.
Thermal Frontiers in the Design and Packaging of Microelectronic Equipment--Mechanical Engineering/Jun. 1983.
Surface Mounting Alters the PC-Board Scene--Electronics/Feb. 9, 1984.
Inside Technology, Japan's Packaging Goes World Class Electronics/Nov. 11, 1985.
Hamann H. Fredrick
Montanye George A.
Phillips Michael W.
Picard Leo P.
Rockwell International Corporation
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