Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-04-09
1999-03-30
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361704, 361707, 361761, 361719, 257720, H05K 720
Patent
active
058896546
ABSTRACT:
Integrated circuit chips (18, 42, or 56) are packaged within openings formed in a substrate such as PCMCIA Card (20, 40, or 54), thus allowing compliance with overall width dimension requirements for standardized electronic components. The arrangement has the advantages that thermal coefficient of expansion of the chips and cards match, and that a sturdy, multilayer ceramic substrate is used for electrical connection to electronic devices such as laptops, palmtops, and the like. In addition, a second integrated circuit chip (68) can be connected directly to the embedded chip (56), thereby allowing two chips to be accommodated in a card (54) at the same location and allowing chip-to-chip electrical communication. A variety of electrical bonding methods joining the embedded chip to the card can be employed. In addition, a variety of thermal conduction arrangements can be used for cooling the embedded integrated circuit chip.
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Pierson Mark V.
Spink, Jr. Kenneth L.
Youngs, Jr. Thurston B.
Chervinsky Boris L.
International Business Machines - Corporation
Picard Leo P.
Samodovitz, Esq. Arthur J.
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