Advanced chemical mechanical polishing system with smart...

Details Advanced chemical mechanical polishing system with smart... Advanced chemical mechanical polishing system with smart...

2006-08-29

2006-08-29

Thomas, David B. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S288000, C451S296000

Reexamination Certificate

active

07097538

ABSTRACT:
The methods and systems described provide for an in-situ endpoint detection for material removal processes such as chemical mechanical polishing (CMP) performed on a workpiece. In a preferred embodiment, an optical detection system is used to detect endpoint during the removal of planar conductive layers using CMP. An optically transparent polishing belt provides endpoint detection through any spot on the polishing belt. Once endpoint is detected, a signal can be used to terminate or alter a CMP process that has been previously initiated.

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