Advanced chemical mechanical polishing system with smart...

Abrading – Machine – Endless band tool

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C451S288000, C451S006000

Reexamination Certificate

active

06857947

ABSTRACT:
An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.

REFERENCES:
patent: 5558568 (1996-09-01), Talieh et al.
patent: 5605706 (1997-02-01), Roberts
patent: 5762536 (1998-06-01), Pant et al.
patent: 5916012 (1999-06-01), Pant et al.
patent: 6025015 (2000-02-01), Landry-Coltrain et al.
patent: 6066030 (2000-05-01), Uzoh
patent: 6146248 (2000-11-01), Jairath et al.
patent: 6204922 (2001-03-01), Chalmers
patent: 6241583 (2001-06-01), White
patent: 6241585 (2001-06-01), White
patent: 6244935 (2001-06-01), Birang et al.
patent: 6248000 (2001-06-01), Aiyer
patent: 6261959 (2001-07-01), Travis et al.
patent: 6271047 (2001-08-01), Ushio et al.
patent: 6302767 (2001-10-01), Tietz
patent: 6322427 (2001-11-01), Li et al.
patent: 6383332 (2002-05-01), Shelton et al.
patent: 6406363 (2002-06-01), Xu et al.
patent: 6447369 (2002-09-01), Moore
patent: 6475070 (2002-11-01), White
patent: 6514775 (2003-02-01), Chen et al.
patent: 6517413 (2003-02-01), Hu et al.
patent: 6607422 (2003-08-01), Swedek et al.
patent: 6609947 (2003-08-01), Moore
patent: 6620031 (2003-09-01), Renteln
patent: 6629874 (2003-10-01), Halley
patent: 6664557 (2003-12-01), Amartur
patent: 6670200 (2003-12-01), Ushio et al.
patent: 6673637 (2004-01-01), Wack et al.
patent: 20010036676 (2001-11-01), Mitsuhashi et al.
patent: 20020127950 (2002-09-01), Hirose et al.
patent: 20020173225 (2002-11-01), Wang et al.
patent: 20030153245 (2003-08-01), Talieh et al.
patent: 2000183002 (2000-06-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Advanced chemical mechanical polishing system with smart... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Advanced chemical mechanical polishing system with smart..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Advanced chemical mechanical polishing system with smart... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3509227

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.