Advanced Bi-directional linear polishing system and method

Abrading – Abrading process – Utilizing nonrigid tool

Reexamination Certificate

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Details

C451S168000, C451S011000, C451S296000, C451S312000

Reexamination Certificate

active

06908368

ABSTRACT:
The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism is used to ensure that the tension of the polishing pad is consistently maintained.

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J.M. Steigerwald, et al., “Pattern Geometry Effects in the Chemical-Mechanical Polishing of Inlaid Copper Structures”, Oct. 1994, pp. 2842-2848, In U.S. Appl. No. 09/576,064.

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