Adjuvant for CMP slurry

Details Adjuvant for CMP slurry Adjuvant for CMP slurry

2007-04-11

2011-11-22

Deo, Duy (Department: 1713)

Abrasive tool making process, material, or composition

With inorganic material

C051S308000, C051S309000

Reexamination Certificate

active

08062395

ABSTRACT:
Disclosed is an adjuvant in use for a process of polishing a cationically charged material and an anionically charged material at the same time with abrasive particles, which is absorbed onto the cationically charged material thereby to restrain the cationically charged material from being polished, resulting in raising a polishing selectivity of the anionically charged material, wherein the adjuvant comprises polymer particles having a core-shell structure with a nano-scale particle size smaller than that of the abrasive particles, surfaces of which are anionically charged. CMP (chemical mechanical polishing) slurry comprising the above adjuvant and abrasive particles is also disclosed.

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