Adjustment of a solder wave process in real-time

Details Adjustment of a solder wave process in real-time Adjustment of a solder wave process in real-time

1994-11-21

1996-07-23

Bradley, P. Austin

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 37, 228 11, H05K 334, B23K 306

Patent

active

055381758

ABSTRACT:
In a wave solder manufacturing process, a test device is used to measure the contact-area between a solder wave and a printed wiring board. In particular, the test device is a printed wiring board (PWB) that includes at least two arrays of electrical contacts, one array near each side of the PWB. As the PWB makes contact with a solder wave, the number of electrical contacts in each array that are grounded by the solder wave are counted and displayed on an alpha-numeric display mounted on top of the PWB. This "distance-based" measurement provides an accurate determination of the uniformity of the contact-area, and concomitantly the dwell-time of the soldering process. This test device provides a basis for real-time adjustment of solder wave height, and end-to-end balance, in a solder wave machine. In particular a wave solder machine includes a means for receiving contact-area information from the test device and a means for adjusting the solder wave in response to the contact-area information.

REFERENCES:
patent: 4180199 (1979-12-01), O'Rourke et al.
patent: 4632291 (1986-12-01), Rahn et al.
patent: 5023848 (1991-06-01), Frey et al.
patent: 5388468 (1995-02-01), Sasson
Excerpt from a manual on a Sensbey Soldering Machine (Jan. 1990).

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