Adjusting the damping level of an encapsulated device

Details Adjusting the damping level of an encapsulated device Adjusting the damping level of an encapsulated device

2011-06-28

2011-06-28

Williams, Hezron (Department: 2856)

Measuring and testing

Instrument casing

Reexamination Certificate

active

07966880

ABSTRACT:
Encapsulated devices that can adjust the damping level within are provided. In this regard, a representative encapsulated device, among others, comprises a bottom substrate, a middle substrate that is disposed above the bottom substrate, and a top substrate that is disposed above the middle substrate. The middle substrate comprises an outermost structure and at least one damping device. The at least one damping device is supported to the outermost structure. At least one top gap and a bottom gap are formed between the at least one damping device and the top and bottom substrates, respectively. The at least one top gap has at least one cavity depth that is adapted to adjust the damping level of the encapsulated device.

REFERENCES:
patent: 2003/0218283 (2003-11-01), Yasumura et al.

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