Adjusting die placement on a semiconductor wafer to increase...

Details Adjusting die placement on a semiconductor wafer to increase... Adjusting die placement on a semiconductor wafer to increase...

2007-01-30

2007-01-30

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S460000

Reexamination Certificate

active

10802549

ABSTRACT:
A die placement of dice to be formed on a semiconductor wafer is adjusted by obtaining a die placement and one or more locations on the wafer contacted by one or more processing structures or a substance emitted by one or more processing structures. The die placement is adjusted based on the obtained one or more locations on the wafer.

REFERENCES:
patent: 5933351 (1999-08-01), Balamurugan
patent: 6756796 (2004-06-01), Subramanian
patent: 2003/0094965 (2003-05-01), Tseng

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