Adjusting a characteristic of a conductive via stub in a...

Details Adjusting a characteristic of a conductive via stub in a... Adjusting a characteristic of a conductive via stub in a...

2006-11-09

2009-08-25

Takaoka, Dean O (Department: 2817)

Wave transmission lines and networks

Coupling networks

With impedance matching

C333S246000

Reexamination Certificate

active

07579925

ABSTRACT:
A circuit board construction which reduces unwanted electrical effects and lower signal quality resulting from the use of vias in relatively thick circuit boards or in circuit boards carrying signals of relatively high frequency. The circuit board includes a through-hole in the circuit board substrate for carrying a conductive via stub, the stub having an inherent stub characteristic; and a compensation element, such as a surface mount capacitor, positioned on the substrate such that when the stub is carried by the through-hole the inherent stub characteristic is adjusted to define a compensated stub characteristic.

REFERENCES:
patent: 6359234 (2002-03-01), Kouda
patent: 6778043 (2004-08-01), Stoddard et al.

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