Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1980-12-11
1984-05-08
Godici, Nicholas P.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228260, B23K 306
Patent
active
044470010
ABSTRACT:
A solder or other liquid wave forming machine has a solder delivery chamber with a tapered depth profile to deliver solder uniformly from a horizontal stream to plural vertical chambers from which the upwardly flowing solder exits to form a solder wave. The wave has substantially uniform height and contour over its width. A slide valve cooperates with baffles that form the vertical chambers selectively to block flow from a prescribed number of chambers to adjust the width of the solder wave. Curved re-entry baffles direct the flow vector of the solder returning from the wave into a main solder supply tank in a horizontal direction to minimize turbulence at such surface and, thus, the formation and circulation of dross.
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Allen Melvin K.
Berri Ronald J.
Winther Douglas N.
Banner/Technical Devices Company, Inc.
Godici Nicholas P.
Jordan M.
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