Plastic article or earthenware shaping or treating: apparatus – With interposed non-adhering web or sheet type parting means
Patent
1977-08-31
1979-05-15
Lake, Roy
Plastic article or earthenware shaping or treating: apparatus
With interposed non-adhering web or sheet type parting means
264DIG84, 425224, 425329, 425471, 425817C, B29D 2704
Patent
active
041545621
ABSTRACT:
The pour plate that is inclined downwardly between the side conveyors of a U-shaped continuous molding tunnel is adjustable in width between the correspondingly adjustable side conveyors so as to selectively produce flat-top buns of foamed synthetic resin of a desired width within the range of adjustment. Interdigitating T-shaped fingers are transversely expandible to form the pour plate and have the gaps between the fingers closed by a cover sheet extending completely over the pour plate with sides being folded downwardly between the pour plate and side conveyors where they are attached to a bias that holds the cover sheet in stretched condition over the pour plate. The bottom cover web that travels with the foam may be folded or cut to the adjusted width of the pour plate. The interdigitated finger construction of the pour plate permits adjustment of the pour plate profile so as to correspond to the rise/time curve of the foam as it expands on our pour plate.
REFERENCES:
patent: 3809512 (1974-05-01), Blackwell et al.
patent: 3836298 (1974-09-01), Ernst
patent: 4005958 (1977-02-01), Porter
patent: 4074960 (1978-02-01), Dockray et al.
Beall, Jr. Thomas E.
Kornylak Corporation
Lake Roy
Rosenbaum Mark
LandOfFree
Adjustable width molding apparatus for a flat-top bun does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adjustable width molding apparatus for a flat-top bun, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adjustable width molding apparatus for a flat-top bun will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1094959