Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-04-06
1996-05-21
Schwartz, Larry I.
Metal working
Method of mechanical manufacture
Electrical device making
29832, H05K 330
Patent
active
055177530
ABSTRACT:
A thermal conduction module comprises a base plate for holding a chip substrate, an integrated circuit chip substrate mounted in the base plate and a cover plate having a surface facing the chip substrate. A movable spacer is secured adjacent to the periphery of the cover plate or the base plate, and is adjustable to a predetermined distance away from the cover plate or base plate. A gap for insertion of a thermally conductive paste may be created between chips mounted on the substrate and the cover plate surface facing the chip substrate by adjustment of the spacer to a desired distance from the cover plate or base plate.
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Ahsan Aziz M.
Coley Adrian L.
International Business Machines - Corporation
Peterson Peter W.
Schwartz Larry I.
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