Adjustable height work holder for bonding semiconductor dies

Details Adjustable height work holder for bonding semiconductor dies Adjustable height work holder for bonding semiconductor dies

1992-12-09

1994-08-23

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 495, 228 565, B23K 3704

Patent

active

053400119

ABSTRACT:
In a semiconductor wire bonder, the need for frequently changing chucks and re-focusing optical equipment for each different die/package thickness combination is alleviated by providing an adjustable stop mechanism lifting the upward displacement of the die/package off of a carrier. The adjustable stop mechanism includes a first, stationary bracket having a leg extending towards a movable lifting member of the bonder, and a second bracket mounted to the movable lifting member. A set screw extending through the leg of the first bracket limits the upward movement of the movable member, and ensures that the front surface of a die being bonded is at an optimum position for bonding.

REFERENCES:
patent: 3995845 (1976-12-01), Scheffer
Die Bonding, MMT, pp. 21-31, Aug. 1991.

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