Adhesives on polymide films and methods of preparing them

Details Adhesives on polymide films and methods of preparing them Adhesives on polymide films and methods of preparing them

1991-02-20

1993-04-27

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

528 98, 528 70, 428220, 428901, B32B 900

Patent

active

052060748

ABSTRACT:
Disclosed is a polymeric product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Also disclosed is an organic polymeric dielectric composite of organic polymeric films, as polyimide films, dispersed in and reinforcing the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Further disclosed is an electronic circuit package that is adapted to receive at least one microelectronic circuit chip, with at least one layer having a substrate of an organic polymeric dielectric composite of organic polymeric films and the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane.

REFERENCES:
patent: 4725484 (1988-02-01), Kumagawa et al.
patent: 4745215 (1988-05-01), Cox et al.

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