Adhesives having improved chemical resistance and curable...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From silicon reactant having at least one...

Reexamination Certificate

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C528S015000, C528S042000

Reexamination Certificate

active

07045586

ABSTRACT:
This invention relates to a composition that can be cured to form an adhesive. The adhesive is useful in the electronics industry. The composition is prepared by mixing components including:(I) a polyorganosiloxane having an average of at least two terminally-unsaturated organic groups per molecule,(II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule,(III) a hydrosilylation catalyst,(IV) a fluoroorganosilicone having at least one functional group reactive with component (I), component (II), or both,(V) an unsaturated ester-functional compound, and(VI) an adhesion promoter.The composition may also include one or more optional components selected from (VII) a void reducing agent, (VIII) a pigment, (IX) a filler, (X) a cure modifier, (XI) a rheology modifier, and (XII) a spacer.

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ABSTRACT CA2009072, 19900820, Kasuya, A., Adhesion promoter for curable organopolysiloxane compsns.—exhibiting excellent adhesion to organic and inorganic substrates in the cured form.
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