Adhesives for semiconductor applications efficient processes...

Details Adhesives for semiconductor applications efficient processes... Adhesives for semiconductor applications efficient processes...

2006-07-11

2006-07-11

Resan, Stevan A. (Department: 1773)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

C428S327000, C526S059000, C526S072000, C196S046100

Reexamination Certificate

active

07074481

ABSTRACT:
Die attach adhesives and methods for their use, along with the devices that are obtained by the use of the methods. Using semiconductor chips as an example, the adhesives and the method for using them provides an interface between a chip (die) and the chip support. The method includes creating a space between the chip and the chip support of a given sized opening.

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