Adhesives, adhesive layers for electroless plating and printed c

Details Adhesives, adhesive layers for electroless plating and printed c Adhesives, adhesive layers for electroless plating and printed c

1994-05-16

1996-05-21

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174258, 174256, H05K 102

Patent

active

055191770

ABSTRACT:
An adhesive usable for electroless plating in the formation of printed circuit boards is formed by dispersing a cured heat-resistant resin powder soluble in an acid or an oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in an acid or an oxidizing agent after the curing treatment, in which the heat-resistant resin matrix is a mixture of a thermoplastic resin and an uncured thermosetting resin or an uncured photosensitive resin.

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