Adhesively mountable die attach film

Stock material or miscellaneous articles – Structurally defined web or sheet – Continuous and nonuniform or irregular surface on layer or...

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Details

428195, 428210, 174212, 156238, D06N 704, B32B 300, H01B 1700

Patent

active

046876936

ABSTRACT:
The present invention is a die attach film which is adapted for adhesive mounting to a dicing frame. The film contains a support film, a curable die bonding adhesive releasably mounted on the support film which is adapted to receive semiconductor wafer, semiconductor die, and the like, and adhesive means to bond the support film to a dicing frame. In one embodiment the adhesive means comprise pressure sensitive adhesive means on the support film itself adjacent the portions designed to contact the dicing frame. In another embodiment, the adhesive means comprise a larger tacky film bonded to the bottom of the support film for the die attach film.

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