Adhesively and magnetically holding an article

Metal working – Method of mechanical manufacture – Assembling or joining

Patent

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Details

29590, 427 8, 427 47, 427 82, 427128, 156155, 156344, B01J 1700

Patent

active

040719448

ABSTRACT:
In fabrication of articles, such as semiconductor devices, the articles are adhered to the surface of a magnetized carrier having grooves with a suitable adhesive. Preferably, the grooves are parallel and in sets which intersect each other. The articles are made susceptible to the attraction of a magnetic field. The adhesive is removed by the flow of solvent vapor and liquid through the grooves while the articles are retained in their original position by magnetic forces.
In an alternate method, the articles may be adhered initially to a nonmagnetic substrate, made susceptible to the attraction of magnetic field and transferred to a grooved, magnetized carrier. Any adhesive which clings to the articles is removed by solvent vapor and liquid as before.

REFERENCES:
patent: 3555659 (1972-01-01), Mracek
patent: 3635730 (1972-01-01), Sweitzer
patent: 3652075 (1972-03-01), Thompson
patent: 3681139 (1972-08-01), Jannett
patent: 3765431 (1973-10-01), Jannett
patent: 3783499 (1974-01-01), Hughes
patent: 3793706 (1974-02-01), Dohlen
patent: 3809233 (1974-05-01), Gruszka
patent: 3847697 (1974-11-01), Baker
patent: 3850721 (1974-11-01), Schubert
patent: 3894633 (1975-07-01), Egan
patent: 3899379 (1975-08-01), Wanesky
patent: 3915784 (1975-10-01), Makhijani
Bachman et al., "Method of Aligning...Wafer", Western Electric, Technical Digest No. 33, pp. 5-6, (Jan. 1974).

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