Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-10-04
1996-07-23
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
264149, 26427211, 29841, 347 20, B41J 205
Patent
active
055385869
ABSTRACT:
A method of encapsulating exposed conductive traces connecting an ink-jet printhead die to an interconnection circuit attached to a headland region of an ink-jet pen cartridge. The cartridge includes a frame structure fabricated of a rigid plastic frame member formed of a first plastic material and a polymeric second material molded to the frame member. The headland region is defined at the tip of a snout region of the cartridge. The second plastic material coats the headland region. The printhead assembly includes a thermoplastic cover layer, a flexible interconnection circuit and a printhead die and orifice plate affixed to the circuit. The second plastic material at the headland region includes regions of additional material. The printhead assembly is attached to the headland region. Heat and pressure are applied to melt the regions of additional second plastic material so that this material reflows to encapsulate the die traces.
REFERENCES:
patent: 4500895 (1985-02-01), Buck et al.
patent: 4600927 (1986-07-01), Sugitani
patent: 4683481 (1987-07-01), Johnson
patent: 4859378 (1989-08-01), Wolcott
patent: 4926197 (1990-05-01), Childers et al.
patent: 4967208 (1990-10-01), Childers
patent: 5189787 (1993-03-01), Reed et al.
patent: 5198834 (1993-03-01), Childers et al.
patent: 5278584 (1994-01-01), Keefe et al.
patent: 5297331 (1994-03-01), Childers
patent: 5408738 (1995-04-01), Schantz et al.
patent: 5420627 (1995-05-01), Kaefer et al.
patent: 5440333 (1995-08-01), Sykora et al.
patent: 5442384 (1995-08-01), Schantz et al.
patent: 5442386 (1995-08-01), Childers et al.
patent: 5450113 (1995-09-01), Childers et al.
patent: 5451995 (1995-09-01), Swanson et al.
Xerox Disclosure Journal, Wire Band Encapsulation Method For Full Width Semiconductor Arrays, Quinn et al (Oct. 1992).
Branon Sonic Power Company, "Ultrasonic Plastics Assembly", 1979, pp. 49-52.
Hewlett-Packard Journal, vol. 36, No. 5, May 1985.
Hewlett-Packard Journal, vol. 39, No. 4, Aug. 1988.
Childers Winthrop D.
Marler Jaren D.
Swanson David W.
Ball Michael W.
Hewlett--Packard Company
Yao Samchuan
LandOfFree
Adhesiveless encapsulation of tab circuit traces for ink-jet pen does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adhesiveless encapsulation of tab circuit traces for ink-jet pen, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesiveless encapsulation of tab circuit traces for ink-jet pen will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-710398