Adhesiveless encapsulation of tab circuit traces for ink-jet pen

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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264149, 26427211, 29841, 347 20, B41J 205

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active

055385869

ABSTRACT:
A method of encapsulating exposed conductive traces connecting an ink-jet printhead die to an interconnection circuit attached to a headland region of an ink-jet pen cartridge. The cartridge includes a frame structure fabricated of a rigid plastic frame member formed of a first plastic material and a polymeric second material molded to the frame member. The headland region is defined at the tip of a snout region of the cartridge. The second plastic material coats the headland region. The printhead assembly includes a thermoplastic cover layer, a flexible interconnection circuit and a printhead die and orifice plate affixed to the circuit. The second plastic material at the headland region includes regions of additional material. The printhead assembly is attached to the headland region. Heat and pressure are applied to melt the regions of additional second plastic material so that this material reflows to encapsulate the die traces.

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